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M24L816512SA-55BEG 参数 Datasheet PDF下载

M24L816512SA-55BEG图片预览
型号: M24L816512SA-55BEG
PDF下载: 下载PDF文件 查看货源
内容描述: 8兆位( 512K ×16 )伪静态RAM [8-Mbit (512K x 16) Pseudo Static RAM]
分类和应用:
文件页数/大小: 14 页 / 328 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M24L816512SA  
Truth Table[20]  
Inputs/Outputs  
High Z  
High Z  
Mode  
Power  
CE  
H
X
OE  
X
X
WE  
X
X
BHE  
X
H
BLE  
X
H
Deselect/Power-Down  
Deselect/Power-Down  
Standby (ISB  
Standby (ISB  
)
)
L
H
L
L
L
Data Out (I/O0–I/O15)  
Read (Upper Byte and Lower Byte)  
Active (ICC  
)
Data Out (I/O0–I/O7);  
(I/O8–I/O15) in High Z  
Data Out (I/O8–I/O15);  
(I/O0–I/O7) in High Z  
L
H
L
H
L
Read (Lower Byte only)  
Active (ICC  
)
L
H
L
L
H
Read (Upper Byte only)  
Active (ICC  
)
L
L
L
L
L
H
H
H
L
H
H
H
X
X
L
H
L
L
L
H
L
L
High Z  
Output Disabled  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
Active (ICC  
)
)
)
)
)
High Z  
Output Disabled  
High Z  
Output Disabled  
L
Data In (I/O0–I/O15)  
Write (Upper Byte and Lower Byte)  
Write (Lower Byte Only)  
Data In (I/O0–I/O7);  
(I/O8–I/O15) in High Z  
Data Out (I/O8–I/O15);  
(I/O0–I/O7) in High Z  
L
H
L
L
X
L
H
Write (Upper Byte Only)  
Active (ICC  
)
Ordering Information  
Speed (ns)  
Ordering Code  
Package Type  
Operating Range  
Extended  
Extended  
Extended  
Extended  
Industrial  
55  
70  
55  
70  
55  
70  
55  
70  
M24L816512SA-55BEG  
M24L816512SA -70BEG  
M24L816512SA-55TEG  
M24L816512SA-70TEG  
M24L816512SA-55BIG  
M24L816512SA-70BIG  
M24L816512SA-55TIG  
M24L816512SA-70TIG  
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.2 mm) (Pb-Free)  
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.2 mm) (Pb-Free)  
44-pin TSOPII (Pb-Free)  
44-pin TSOPII (Pb-Free)  
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.2 mm) (Pb-Free)  
48-ball Very Fine Pitch BGA (6.0 x 8.0 x 1.2 mm) (Pb-Free)  
44-pin TSOPII (Pb-Free)  
Industrial  
Industrial  
44-pin TSOPII (Pb-Free)  
Industrial  
Note:  
20.H = Logic HIGH, L = Logic LOW, X = Don’t Care.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jun. 2009  
Revision : 1.5  
10/14  
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