ESMT
Preliminary
M24L16161A
PACKING DIMENSIONS
48/48-BALL Mini-BGA ( 6x8mm ) Outline Dimensions
Symbol
Dimension in mm
Dimension in inch
Norm
Min
1.14
0.20
0.30
5.90
Norm
---------------
0.25
Max
1.40
0.30
0.40
6.10
Min
Max
A
A1
0.049
0.008
0.012
0.232
---------------
0.010
0.055
0.012
Φb
D
0.35
0.014
0.016
0.240
6.00
0.236
D1
---------------
7.90
3.75
8.00
5.25
0.75
0.10
0.08
0.10
0.20
0.10
--------------- ---------------
0.148
0.315
0.207
0.030
0.004
0.003
0.004
0.008
0.004
---------------
0.319
E
8.10
0.311
E1
---------------
---------------
--------------- ---------------
--------------- ---------------
---------------
---------------
e
aaa
bbb
ccc
ddd
eee
NOTE :
1. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM C.
3. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE SOLDER BALL AND THE
BODY EDGE.
4. REFERENCE DOCUMENT : JEDEC MO-207.
Elite Semiconductor Memory Technology Inc.
Publication Date : Jul. 2003
Revision : 0.2 14/15
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
