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M13S2561616A-5BIG2S 参数 Datasheet PDF下载

M13S2561616A-5BIG2S图片预览
型号: M13S2561616A-5BIG2S
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 13 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-60]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 49 页 / 1245 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M13S2561616A (2S)  
Operation Temperature Condition -40°C~85°C  
Read  
This command is used after the row activate command to initiate the burst read of data. The read command is initiated by  
activating CS ,RAS , CAS , and deasserting WE at the same clock rising edge as described in the command truth table. The  
length of the burst and the CAS latency time will be determined by the values programmed during the MRS command.  
Write  
This command is used after the row activate command to initiate the burst write of data. The write command is initiated by  
activating CS ,RAS , CAS , and WE at the same clock rising edge as describe in the command truth table. The length of the  
burst will be determined by the values programmed during the MRS command.  
Burst Read Operation  
Burst Read operation in DDR SDRAM is in the same manner as the current SDRAM such that the Burst read command is  
issued by asserting CS and CAS low while holding RAS and WE high at the rising edge of the clock (CLK) after tRCD  
from the bank activation. The address inputs determine the starting address for the Burst. The Mode Register sets type of burst  
(Sequential or interleave) and burst length (2, 4, 8). The first output data is available after the CAS Latency from the READ  
command, and the consecutive data are presented on the falling and rising edge of Data Strobe (DQS) adopted by DDR  
SDRAM until the burst length is completed.  
<Burst Length = 4, CAS Latency = 3>  
0
1
2
3
4
5
6
7
8
C L K  
CL K  
RE A D  
A
N OP  
NO P  
N OP  
NO P  
C OM MA ND  
NO P  
N O P  
N O P  
NO P  
t RPS T  
tR P RE  
D QS  
DQ ' s  
C A S L a t e n cy = 3  
DO U T 3  
DO U T 0 DO U T 1 DO U T 2  
Burst Write Operation  
The Burst Write command is issued by having CS , CAS and WE low while holding RAS high at the rising edge of the  
clock (CLK). The address inputs determine the starting column address. There is no write latency relative to DQS required for  
burst write cycle. The first data of a burst write cycle must be applied on the DQ pins tDS prior to data strobe edge enabled after  
t
DQSS from the rising edge of the clock (CLK) that the write command is issued. The remaining data inputs must be supplied on  
each subsequent falling and rising edge of Data Strobe until the burst length is completed. When the burst has been finished,  
any additional data supplied to the DQ pins will be ignored.  
<Burst Length = 4>  
*1  
0
1
2
3
4
5
6
7
8
C L K  
C L K  
N OP  
N O P  
N O P  
N O P  
N O P  
W RITE A  
N O P  
W RITE B  
N O P  
C O MM A N D  
t
DQ S S max  
D Q S  
D Q ' s  
*1  
* 1  
W P RE S  
t
Note * 1: The specific requirement is that DQS be valid (High or Low) on or before this CLK edge. The case shown (DQS going from  
High-Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS  
could be High at this time, depending on tDQSS  
.
Elite Semiconductor Memory Technology Inc.  
Publication Date : Jan. 2015  
Revision : 1.0 18/49  
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