EN29LV160A
EN29LV160A
T
-
70
T
C
P
PACKAGING CONTENT
(Blank) = Conventional
P = Pb Free
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (-40°C to +85°C)
PACKAGE
U = 44-pin SOP
T = 48-pin TSOP
B = 48-Ball Thin Fine Pitch Ball Grid Array (TFBGA)
0.80mm pitch, 6mm x 8mm package
SPEED
70 = 70ns
90 = 90ns
BOOT CODE SECTOR ARCHITECTURE
T = Top boot Sector
B = Bottom boot Sector
BASE PART NUMBER
EN = Eon Silicon Solution Inc.
29LV = FLASH, 3V Read Program Erase
160 = 16 Megabit (2M x 8 / 1M x 16)
A = version identifier
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
43
Rev. I, Issue Date: 2008/07/17
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
