EN29LV641H/L EN29LV640U
USER MODE DEFINITIONS
TABLE 3. BUS OPERATIONS
Operation
CE#
OE# WE# RESET#
WP#
ACC
A21-A0 DQ15-DQ0
Read
L
L
H
H
X
X
H
X
H
L
H
H
H
X
X
AIN
AIN
AIN
X
DOUT
Write
L
L
(Note 1)
X
VHH
H
(Note 3)
(Note 3)
High-Z
High-Z
High-Z
High-Z
Accelerated
Program
L
(Note 1)
Vcc
0.3V
±
Vcc ±
0.3V
CMOS Standby
TTL Standby
X
X
H
X
X
X
X
X
H
L
H
H
X
Output Disable
Hardware Reset
H
L
X
X
X
X
X
SA,
Sector Group
Protect
A6=L,
A1=H,
A0=L
SA,
L
H
L
VID
H
X
(Note 3)
Sector Group
Unprotect
A6=H,
A1=H,
A0=L
L
H
X
L
VID
VID
H
H
X
X
(Note 3)
(Note 3)
Temporary
Sector
Group
X
X
AIN
Unprotect
L=logic low= VIL, H=Logic High= VIH, VID = VHH = 11 ± 0.5V = 10.5 ─11.5V, X=Don’t Care (either
L or H, but not floating!), SA=Sector Addresses (A21-A15), DIN=Data In, DOUT=Data Out,
AIN=Address In
Notes:
1. If the system asserts VIL on the WP# pin, the device disables program and erase functions in
the first or last sector independent of whether those sectors were protected or unprotected; if
the system asserts VIH on the WP# pin, the device reverts to whether the first or last sector was
previously protected or unprotected. If ACC = VHH, all sectors will be unprotected.
2. Please refer to “Sector Group Protection & Unprotection”, Flowchart 6a and Flowchart 6b.
3. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm.
Read Mode
The device is automatically set to reading array data after device power-up or hardware reset. No
commands are required to retrieve data. The device is also ready to read array data after completing an
Embedded Program or Embedded Erase algorithm
After the device accepts an Sector Erase Suspend command, the device enters the Sector Erase
Suspend mode. The system can read array data using the standard read timings, except that if it reads
at an address within erase-suspended sectors, the device outputs status data. After completing a
programming operation in the Sector Erase Suspend mode, the system may once again read array
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2005 Eon Silicon Solution, Inc., www.essi.com.tw
10
Rev. B, Issue Date: 2005/06/27