EN25F05
Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific
device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down /
Device ID instruction. The instruction is initiated by driving the CS# pin low and shifting the
instruction code “90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufac-
turer ID for Eon (1Ch) and the Device ID are shifted out on the falling edge of CLK with most
significant bit (MSB) first as shown in Figure 17. The Device ID values for the EN25F05 are listed in
Table 5. If the 24-bit address is initially set to 000001h the Device ID will be read first
Figure 18. Read Manufacturer / Device ID Diagram
Read Identification (RDID)(9Fh)
The Read Identification (RDID) instruction allows the 8-bit manufacturer identification to be read,
followed by two bytes of device identification. The device identification indicates the memory type in
the first byte , and the memory capacity of the device in the second byte .
Any Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in progress. The Read Identification (RDID)
instruction should not be issued while the device is in Deep Power down mode.
The device is first selected by driving Chip Select Low. Then, the 8-bit instruction code for the
instruction is shifted in. This is followed by the 24-bit device identification, stored in the memory,
being shifted out on Serial Data Output , each bit being shifted out during the falling edge of Serial
Clock . The instruction sequence is shown in Figure 19. The Read Identification (RDID) instruction is
terminated by driving Chip Select High at any time during data output.
When Chip Select is driven High, the device is put in the Standby Power mode. Once in the Standby
Power mode, the device waits to be selected, so that it can receive, decode and execute instructions.
This Data Sheet may be revised by subsequent versions
or modifications due to changes in technical specifications.
©2004 Eon Silicon Solution, Inc., www.essi.com.tw
19
Rev. B, Issue Date: 2008/06/23
EON [ EON SILICON SOLUTION INC. ]
