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EN25D16-100HI 参数 Datasheet PDF下载

EN25D16-100HI图片预览
型号: EN25D16-100HI
PDF下载: 下载PDF文件 查看货源
内容描述: 16兆位串行闪存 [16 Megabit Serial Flash Memory]
分类和应用: 闪存
文件页数/大小: 37 页 / 483 K
品牌: EON [ EON SILICON SOLUTION INC. ]
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EN25D16  
Figure 13. Sector Erase Instruction Sequence Diagram  
Block Erase (BE) (D8h/52h)  
The Block Erase (BE) instruction sets to 1 (FFh) all bits inside the chosen block. Before it can be  
accepted, a Write Enable (WREN) instruction must previously have been executed. After the Write  
Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).  
The Block Erase (BE) instruction is entered by driving Chip Select (CS#) Low, followed by the in-  
struction code, and three address bytes on Serial Data Input (DI). Any address inside the Block (see  
Table 2) is a valid address for the Block Erase (BE) instruction. Chip Select (CS#) must be driven  
Low for the entire duration of the sequence.  
The instruction sequence is shown in Figure 14. Chip Select (CS#) must be driven High after the  
eighth bit of the last address byte has been latched in, otherwise the Block Erase (BE) instruction is  
not executed. As soon as Chip Select (CS#) is driven High, the self-timed Block Erase cycle (whose  
duration is t ) is initiated. While the Block Erase cycle is in progress, the Status Register may be  
SE  
read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1  
during the self-timed Block Erase cycle, and is 0 when it is completed. At some unspecified time  
before the cycle is completed, the Write Enable Latch (WEL) bit is reset.  
A Block Erase (BE) instruction applied to a block which is protected by the Block Protect (BP2, BP1,  
BP0) bits (see Table 3) is not executed.  
Figure 14 Block Erase Instruction Sequence Diagram  
This Data Sheet may be revised by subsequent versions  
or modifications due to changes in technical specifications.  
©2004 Eon Silicon Solution, Inc., www.essi.com.tw  
19  
Rev. B, Issue Date: 2008/06/23  
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