EM78P312N
8-Bit Microcontroller
APPENDIX
A Package Types:
OTP MCU
EM78P312NP
EM78P312NK
EM78P312NAK
EM78P312NM
EM78P312NS
Package Type
DIP
Pin Count
Package Size
600 mil
28
28
28
28
28
SDIP
400 mil
SDIP
300 mil
SOP
300 mil
SSOP
209 mil
Y/S/J：Green product does not contain hazardous substances.
The third edition of Sony SS-00259 standard.
Pb content should be less than 100ppm.
Pb content to fit in with Sony spec.
Part No.
Electroplate type
Ingredient (%)
EM78P311SxY
EM78P311SxS/xJ
Sn/Cu
Pure Tin
Cu:1.0~3.0%
~227°C
Sn :100%
232°C
Melting point(°C)
Electrical resistivity
13
11.4
(μΩ-cm)
Hardness (hv)
Elongation (%)
10~12
40%
8~10
>50%
64 •
Product Specification (V1.0) 10.03.2006
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
