BCM4319 Preliminary Data Sheet
Ordering Information
Section 18: Ordering Information
Table 32: Ordering Information
Ambient
Temperature
Part Number
Package
Description
BCM4319GKUBG 138-ball, wafer-level WLBGA package
Single-band 802.11b/g/n
2.4GHz WLAN, USB 2.0,
SDIO
–30 °C to
85 °C
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm
pitch)
BCM4319XKUBG
BCM4319SKUBG
138-ball, wafer-level WLBGA package
Dual-band 802.11a/b/g/n
2.4 GHz and 5 GHz WLAN, 85 °C
USB 2.0, SDIO
–30 °C to
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm
pitch)
138-ball, wafer-level WLGBA package with Single-band 802.11b/g/n
Back Side Protection (BSP)
(5.74 mm x 4.53 mm x 0.5 mm, 0.4 mm
pitch)
–30 °C to
85 °C
2.4 GHz WLAN USB2.0,
SDIO
Broadcom®
Single-Chip IEEE 802.11™ a/b/g/n MAC/Baseband/Radio
Page 82
April 2, 2014 • 4319-DS05-R
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