CPC7582
3.2 Printed-Circuit Board Land Patterns
3.2.1 16-Pin SOIC
3.2.2 16-Pin DFN
1.27
(0.050)
0.35
(0.014)
1.05
(0.041)
9.40
5.80
(0.228)
(0.370)
2.00
(0.079)
0.80
(0.031)
0.60
(0.024)
DIMENSIONS
mm
(inches)
DIMENSIONS
mm
(inches)
NOTE: Because the metallic pad on the bottom of the
DFN package is connected to the substrate of the die,
Clare recommends that no printed circuit board traces
or vias be placed under this area to maintain minimum
creepage and clearance values.
3.3 Tape and Reel Packaging
3.3.1 16-Pin SOIC
Tape and Reel Packaging for 16-Pin SOIC Package
B0=10.70 + 0.15
(0.421 + 0.01)
330.2 Dia
(13.00 Dia)
Pin 1
Top Cover
Tape Thickness
0.102 Max
W=16.00 + 0.30
(0.630 + 0.010)
(0.004 Max)
Top Cover
Tape
P=12.00
(0.47)
A0=10.90 + 0.15
(0.429 + 0.010)
K0=3.20 + 0.15
(0.193 + 0.01)
K1=2.70 + 0.15
(0.106 + 0.01)
Dimensions
Embossed
Carrier
User Direction of Feed
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
18
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