CPC7582
3. Manufacturing Information
3.1 Mechanical Dimensions
3.1.1 16-Pin SOIC
NOTES:
10.211 0.254
(0.402 0.010)
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating (1000 microinch maximum).
PIN 16
10.312 0.381
(0.406 0.015)
7.493 0.127
(0.295 0.005)
DIMENSIONS
mm
PIN1
(inches)
0.406 0.076
(0.016 0.003)
1.270 TYP
(0.050 TYP)
0.254 MIN / 0.737 MAX X 45°
(0.010 MIN / 0.029 MAX X 45°)
2.540 0.152
(0.100 0.006)
2.337 0.051
(0.092 0.002)
0.649 0.102
(0.026 0.004)
0.203 0.102
(0.008 0.004)
0.889 0.178
(0.035 0.007)
0.2311 MIN / 0.3175 MAX
(0.0091 MIN / 0.0125 MAX)
3.1.2 16-Pin DFN
7.00 0.25
(0.276 0.01)
6.00 0.25
(0.236 0.01)
INDEX AREA
TOP VIEW
SIDE VIEW
0.90 0.10
(0.035 0.004)
SEATING
PLANE
0.20
(0.008)
0.02, + 0.03, - 0.02
(0.0008, + 0.0012, - 0.0008)
0.30 0.05
(0.012 0.002)
EXPOSED
METALLIC PAD
1
4.25 0.05
(0.167 0.002)
Terminal Tip
0.80
(0.032)
16
0.55 0.10
(0.022 0.004)
6.00 0.05
(0.236 0.002)
BOTTOM VIEW
Dimensions
mm
(inch)
R05
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