PRELIMINARY
CM1230
Mechanical Details (cont’d)
CSP-6 Mechanical Specifications
The CM1230-04CS/CP is supplied in a 6 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the Califor-
nia Micro Devices CSP Package Information docu-
ment.
Mechanical Package Diagrams
BOTTOM VIEW
A1
OptiGuardTM
Coating
C1
B1
PACKAGE DIMENSIONS
3
Package
Bumps
Custom CSP
6
2
1
Millimeters
Nom Max
Inches
Nom
Dim
A
B
Min
Min
Max
D1
D2
A1
A2
B1
B2
C1
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
1.415 1.460 1.505 0.0557 0.0575 0.0593
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SIDE
VIEW
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1230-04 Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
9
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
