PRELIMINARY
CM1230
Mechanical Details
CSP-4 Mechanical Specifications
The CM1230-02CS/CP is supplied in a 4 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the Califor-
nia Micro Devices CSP Package Information docu-
ment.
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
OptiGuard
TM
Coating
PACKAGE DIMENSIONS
Package
Bumps
Dim
A1
A2
B1
B2
C1
C2
D1
D2
Millimeters
Min
Nom
Max
Min
Custom CSP
4
Inches
Nom
Max
B1
B
B2
A2
A
1
2
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
0.915 0.960 1.005 0.0360 0.0378 0.0396
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
3500 pieces
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
SIDE
VIEW
Package Dimensions for
CM1230-02 Chip Scale Package
# per tape and
reel
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/15/06
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
