PRELIMINARY
CM1230
Mechanical Details (cont’d)
CSP-10 Mechanical Specifications
The CM1230-08CS/CP is supplied in a 10 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the Califor-
nia Micro Devices CSP Package Information docu-
ment.
Mechanical Package Diagrams
BOTTOM VIEW
A1
OptiGuardTM
Coating
C1
B1
PACKAGE DIMENSIONS
5
Package
Bumps
Custom CSP
10
4
3
2
1
Millimeters
Nom
Inches
Nom
Dim
Min
Max
Min
Max
A
A
B
B
A1
A2
B1
B2
C1
C2
D1
D2
0.915 0.960 1.005 0.0360 0.0378 0.0396
2.415 2.460 2.505 0.0951 0.0969 0.0986
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.575 0.644 0.714 0.0226 0.0254 0.0281
0.368 0.419 0.470 0.0145 0.0165 0.0185
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
# per tape and
reel
3500 pieces
Package Dimensions for
CM1230-08 Chip Scale Package
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
10
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 03/15/06
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
