PRELIMINARY
CM1230
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50μm
+20μm
60 seconds
240°C
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
●
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
CALMIRCO [ CALIFORNIA MICRO DEVICES CORP ]
