PRELIMINARY
CM1230
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
A 1
A2
B2
A1
B1
Orientation
Marking
A
B
L
CM1230-02
4-Bump CSP Package
Orientation
Marking
(see note 2)
1
2
3
A 1
Orientation
Marking
A3
B3
A2
B2
A1
B1
A
B
L30
CM1230-04
6-Bump CSP Package
Orientation
Marking
(see note 2)
1
2
3
4
5
A 1
A5
A4
B4
A3
B3
A2
B2
A1
B1
Orientation
Marking
A
B
L308
B5
CM1230-08
10-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
# of Channels
Bumps
Package
Part Marking
Part Marking
2
4
8
4
6
CSP-4
CSP-6
CSP-10
CM1230-02CS
CM1230-04CS
CM1230-08CS
L
CM1230-02CP
CM1230-04CP
CM1230-08CP
L
L30
L308
L30
L308
10
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2006 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com 03/15/06