THERMAL MANAGEMENT
Adequate heat sinking and air flow must be provided to
keep the die temperature below +150 °C. This device is
packaged with the cavity up (the die is on the bottom of
the package). Therefore, CADEKA recommends that the
device be heat sinked by contacting the bottom of the
package through a hole in the circuit board.
The thermal coefficients of the SPT7610 (44L cerquad)
are as follows:
θja
= +78 °C/W (junction to ambient in
still air with no heat sink)
θjc
= +4 °C/W (junction to case)
SUBCIRCUIT SCHEMATICS
Figure 3A – Input Circuit
AGND
AGND
DGND
Figure 3B – Output Circuit
Figure 3C – Clock Input
AGND
V
IN
V
r
CLK
Data Out
CLK
AV
EE
AV
EE
SPT7610
8
1/21/02
CADEKA [ CADEKA MICROCIRCUITS LLC. ]
