High-Speed Response Non-Isolated POL DC-DC Converter
4A/9.5A BSV-M Series
6. Temperature derating
The product requires placement on PCB with good airflow due to a design to release heat through the
PCB. The lines to the converter should be taken thick and wide, especially lines to the GND pin, for it
has a large heat release.
The derating curve below is when mounted onto the double-sided board of copper coating thickness
70µm, copper coating dimension 100mm x 100mm (both sides) and PCB thickness 1.6mm. Please use
it as a reference because the heat release characteristics may change depending on wiring.
Since the temperature characteristics are largely affected by PCB and the ambient temperature, it is
important to make sure that the IC (refer to the outer dimensions) surface temperature of the converter
does not exceed 120ºC when operated at the max ambient temperature in an actual device.
BSV-3.3S4R0M Temperature derating
：Wind velocity2.0[m/s]
：Wind velocity1.0[m/s]
：Wind velocity0.0[m/s]
■Test conditions
Input voltage 5.0[V]
Output voltage 3.3[V]
5
4
3
2
1
-40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Ambient temperature [℃]
BSV-3.3S9R5M Temperature derating
■Test conditions
Input voltage 5.0[V]
：Wind velocity2.0[m/s]
：Wind velocity1.0[m/s]
：Wind velocity0.0[m/s]
Output voltage 3.3[V]
14
12
8
6
4
2
0
-40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90
Ambient temperature[℃]
5
BDD20150226
BELLNIX [ Bellnix ]
