High-Speed Response Non-Isolated POL DC-DC Converter
4A/9.5A BSV-M Series
11. Mounting conditions
Observe the following conditions for soldering temperature and time as well as for the storage before
mounting. Flow mounting is not possible for this product.
11-1 Reflow method
Preheat temperature: 150 to 180ºC, 60sec. max. (Refer to the figure below.)
Peak temperature
: 250ºC max.
220ºC or higher 60sec. max.
Number of reflows : Twice
Note 1) Refrain from giving vibration during the reflow, for it may cause converter components to move.
Note 2) After mounting the converter onto the board, reflow cannot be made again by turning over
the mounted board.
11-2 Storage before mounting
The humidity control level for this product is MSL3. For storage before mounting, if a dry pack is
opened, store at an ambience of 30ºC/60% R.H. or below. If the dry pack storage exceeds one year
or the storage of an opened dry pack at 30ºC/60% R.H. exceeds 168 hours, baking (125ºC±5ºC,
12h) is required before the reflow process.
Storage condition after mounting will subject to 3. Environmental conditions.
温度規定点は部品表面温度
Temp specified point is the surface temp of components
温
度
Peak:250℃ max
220℃
2℃/sec max
1～4℃/sec
180℃
150℃
2.3℃/sec max
60sec max
60sec max
時間
Time
12. Vibration and impact tests
Vibration: 5 to 10Hz Total amplitude 10mm, 10 to 55Hz Acceleration 2G (3 directions, 1 hour
each)
Impact
:
Acceleration 20G (3 directions, 3 times each)
Duration 11±5ms
12
BDD20150226
BELLNIX [ Bellnix ]
