DICE INFORMATION
PAD
FUNCTION
1
2
Offset Trim
–In
3
+In
4
–VS
5
6
7
Offset Trim
Output
+VS
8
NC
NC
No Connection
Substrate Bias: No Connection.
MECHANICAL INFORMATION
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
65 x 54 ±5
20 ±3
4 x 4
1.65 x 1.37 ±0.13
0.51 ±0.08
0.10 x 0.10
Backing
Transistor Count
None
43
OPA606 DIE TOPOGRAPHY
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
4
OPA606
BB [ BURR-BROWN CORPORATION ]
