ABSOLUTE MAXIMUM RATINGS(1)
PIN CONFIGURATION
Top View
TQFP
+IN to GND................................................................................ VA + 0.1V
–IN to GND ....................................................................................... +0.5V
VA to GND ............................................................................. –0.3V to +7V
Digital Input Voltage to GND ................................... –0.3V to (VA + 0.3V)
VOUT to GND ............................................................ –0.3V to (VA + 0.3V)
Operating Temperature Range ......................................–40°C to +105°C
Storage Temperature Range .........................................–65°C to +150°C
Junction Temperature (TJ max) .................................................... +150°C
TQFP Package:
32 31 30 29 28 27 26 25
Power Dissipation ................................................... (TJ max – TA) /θJA
θJA Thermal Impedance......................................................... 240°C/W
Lead Temperature:
1
2
3
4
5
6
7
8
24 CS
DB15
DB14
DB13
DB12
DB11
DB10
DB9
23 BYTE
22 RD
Vapor Phase (soldering, 60s) ................................................. +215°C
Infrared (soldering, 15s) .......................................................... +220°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
21 CONVST
20 CLOCK
19 DGND
18 +VD
ADS8322
ELECTROSTATIC
DISCHARGE SENSITIVITY
17 BUSY
DB8
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
9
10 11 12 13 14 15 16
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet its published specifications.
PIN ASSIGNMENTS
PIN
NAME
DESCRIPTION
PIN
NAME
DESCRIPTION
20
CLOCK
An external CMOS compatible clock can be applied
to the CLOCK input to synchronize the conversion
process to an external source.
1
2
DB15
DB14
DB13
DB12
DB11
DB10
DB9
Data Bit 15 (MSB)
Data Bit 14
3
Data Bit 13
21
22
23
CONVST
RD
Convert Start
4
Data Bit 12
Synchronization pulse for the parallel output.
5
Data Bit 11
BYTE
Selects 8 most significant bits (LOW) or 8 least
significant bits (HIGH). Data valid on pins 9-16.
6
Data Bit 10
3
Data Bit 9
24
25
26
27
28
29
30
31
CS
–IN
Chip Select
8
DB8
Data Bit 8
Inverting Input Channel
Noninverting Input Channel
Analog Ground
9
DB7
Data Bit 7
+IN
10
11
12
13
14
15
16
17
18
19
DB6
Data Bit 6
AGND
+VA
NC
DB5
Data Bit 5
Analog Power Supply, +5VDC.
No Connect
DB4
Data Bit 4
DB3
Data Bit 3
NC
No Connect
DB2
Data Bit 2
REFIN
Reference Input. When using the internal 2.5V refer-
DB1
Data Bit 1
ence tie this pin directly to REFOUT
.
DB0
Data Bit 0 (LSB)
High when a conversion is in progress.
Digital Power Supply, +5VDC.
Digital Ground
32
REFOUT
Reference Output. A 0.1µF capacitor should be con-
nected to this pin when the internal reference is
used.
BUSY
+VD
DGND
PACKAGE/ORDERING INFORMATION
MAXIMUM
INTEGRAL
LINEARITY
ERROR (LSB)
NO
MISSING
CODES
PACKAGE
DRAWING
NUMBER
SPECIFICATION
TEMPERATURE
RANGE
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
PRODUCT
ERROR (LSB)
PACKAGE
ADS8322Y
±8
"
±6
"
14
"
15
"
TQFP-32
351
"
351
"
–40°C to 85°C
ADS8322Y/250
ADS8322Y/2K
ADS8322YB/250
ADS8322YB/2K
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
"
"
"
ADS8322YB
TQFP-32
–40°C to 85°C
"
"
"
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces
of “ADS8322Y/2K” will get a single 2000-piece Tape and Reel.
ADS8322
2
SBAS215
BB [ BURR-BROWN CORPORATION ]
