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ADS5220 参数 Datasheet PDF下载

ADS5220图片预览
型号: ADS5220
PDF下载: 下载PDF文件 查看货源
内容描述: 12位, 40MSPS采样, + 3.3V模拟数字转换器 [12-Bit, 40MSPS Sampling, +3.3V ANALOG-TO-DIGITAL CONVERTER]
分类和应用: 转换器
文件页数/大小: 20 页 / 432 K
品牌: BB [ BURR-BROWN CORPORATION ]
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this case the power dissipation is typically 15mW. With 10µF  
external decoupling capacitor at REFT and REFB, it takes  
about 800µs to fully restore normal operation after the normal  
mode is enabled. Setting QPD to logic high (and STPD to  
logic low) will shut down the internal ADC core while the  
internal reference circuit power remains on. In this case,  
power dissipation is typically 75mW. It takes about 2µs to  
fully restore normal operation after the normal mode is  
enabled. During power-down, data in the converter pipeline  
will be lost and new valid data will be subject to the specified  
pipeline delay.  
should be bypassed with a combination of 0.1µF ceramic  
chip capacitors (0805, low ESR) and a 10µF tantalum tank  
capacitor. A similar approach may be used on the digital  
supply pins DVDD and driver supply pins, VDRV. In order to  
minimize the lead and trace inductance, the capacitors must  
be located as close to the supply pins as possible. They are  
best placed directly under the package where double-sided  
component mounting is allowed. In addition, larger bipolar  
decoupling capacitors (2.2µF to 10µF), effective at lower  
frequencies, may also be used on the main supply pins. They  
can be placed on the PC board in close proximity  
(< 0.5 inches) to the ADC. If the analog inputs to the  
ADS5220 are driven differentially, it is especially important to  
optimize towards a highly symmetrical layout. Small trace  
length differences can create phase shifts compromising a  
good distortion performance. For this reason, the use of two  
single op amps rather than one dual amplifier enables a more  
symmetrical layout and a better match of parasitic capaci-  
tances. The pin orientation of the ADS5220 package follows  
a flow-through design with the analog inputs located on one  
side of the package, whereas the digital outputs are located  
on the opposite side of the quad-flat package. This provides  
a good physical isolation between the analog and digital  
connections. While designing the layout, it is important to  
keep the analog signal traces separated from any digital lines  
to prevent noise coupling onto the analog portion. Try to  
match trace length for the differential clock signal (if used) to  
avoid mismatches in propagation delays. Single-ended clock  
lines must be short and should not cross any other signal  
traces. Short circuit traces on the digital outputs will minimize  
capacitive loading. Trace length must be kept short to the  
receiving gate (< 2 inches) with only one CMOS gate con-  
nected to one digital output. If possible, the digital data  
outputs should be buffered (with the TI SN74LTH16374, for  
example). Dynamic performance can also be improved with  
the insertion of series resistors at each data output line. This  
sets a defined time constant and reduces the slew rate that  
would otherwise flow as the fast edge rate. The resistor value  
may be chosen to give a time constant of 15% to 25% of the  
used data.  
LAYOUT AND DECOUPLING  
Proper grounding and bypassing, short lead length, and the  
use of ground planes are particularly important for high-  
frequency designs. Achieving optimum performance with a  
fast sampling converter like the ADS5220 requires careful  
attention to the PC board layout in order to minimize the  
effect of board parasitics and optimize component place-  
ment. A multi-layer board usually ensures best results and  
allows convenient component placement. The ADS5220 must  
be treated as an analog component, and the AVDD pins  
connected to a clean analog supply. This ensures the most  
consistent results, because digital supplies often carry a high  
level of switching noise that could couple into the converter  
and degrade the performance. The driver supply pins (VDRV)  
must also be connected to a low-noise supply. Supplies of  
adjacent digital circuits can carry substantial current tran-  
sients. The supply voltage must be thoroughly filtered before  
connecting to the VDRV supply of the converter. All ground  
connections on the ADS5220 are internally bonded to the  
metal flag (bottom of package) that forms a large ground  
plane. All ground pins must directly connect to an analog  
ground plane that covers the PC board area under the  
converter. Due to its high sampling frequency, the ADS5220  
generates high frequency current transients and noise (clock  
feedthrough) that are fed back into the supply and reference  
lines. If not sufficiently bypassed, this adds noise to the  
conversion process. See Figure 11 for the recommended  
supply decoupling scheme for the ADS5220. All AVDD pins  
ADS5220  
SBAS261A  
17  
www.ti.com  
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