8 Pin Ceramic DIP Single Channel Schematic
I
I
I
CC
8
7
6
I
F
2
V
V
V
CC
B
ANODE
+
B
V
F
O
-
O
CATHODE
3
5
GND
Note, base is pin 7.
Functional Diagrams
16 Pin DIP
Through Hole
ꢀ Channels
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
ꢀ Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
ꢀ0 Pad LCCC
Surface Mount
ꢀ Channels
15 14
1
V
16
1
16
B1
V
V
CCꢀ
Bꢀ
Oꢀ
1
V
8
1
V
V
8
CC
V
CC
O1
19
ꢀ0
1ꢁ
1ꢀ
ꢀ
ꢁ
4
V
15
14
1ꢁ
ꢀ
ꢁ
4
V
V
V
V
V
15
14
1ꢁ
V
CC1
CC
O1
Oꢀ
Oꢁ
O4
ꢀ
ꢁ
4
7
6
5
ꢀ
ꢁ
4
7
6
5
B
GND
ꢀ
V
O1
V
V
OUT
Oꢀ
V
CC1
ꢀ
ꢁ
10
9
V
7
O1
GND
V
B1
GND
1
GND
GND
5
1ꢀ
5
1ꢀ
V
Bꢀ
8
V
6
7
8
11
10
9
6
7
8
11
10
9
CCꢀ
GND
GND
V
Oꢀ
Note: 8 pin DIP and flat pack devices have common V and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
CC
channels with separate V and ground connections.
CC
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
8.13 (0.320)
MAX.
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
