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5962-8767905KUC 参数 Datasheet PDF下载

5962-8767905KUC图片预览
型号: 5962-8767905KUC
PDF下载: 下载PDF文件 查看货源
内容描述: [2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.4Mbps, HERMETIC SEALED, DIP-16]
分类和应用: 输出元件光电
文件页数/大小: 13 页 / 210 K
品牌: AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
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EachchannelcontainsaGaAsPlightemittingdiodewhich  
is optically coupled to an integrated photon detector.  
Separate connections for the photodiodes and output  
transistor collectors improve the speed up to a hundred  
times that of a conventional phototransistor optocoupler  
by reducing the base-collector capacitance.  
Truth Table  
(Positive Logic)  
Input  
On (H)  
Off (L)  
Output  
L
These devices are suitable for wide bandwidth analog  
applications, as well as for interfacing TTL to LSTTL or  
H
Functional Diagram  
CMOS. Current Transfer Ratio (CTR) is 9% minimum at I  
F
= 16 mA. The 18V V capability will enable the designer  
CC  
Multiple Channel Devices Available  
to interface any TTL family to CMOS. The availability of  
the base lead allows optimized gain/ bandwidth adjust-  
ment in analog applications. The shallow depth of the  
IC photodiode provides better radiation immunity than  
conventional phototransistor couplers.  
V
CC  
V
V
B
O
These products are also available with the transistor base  
node not connected to improve common mode noise  
immunity and ESD susceptibility. In addition, higher CTR  
minimums are available by special request.  
GND  
Packagestylesforthesepartsare8and16pinDIPthrough  
hole (case outlines P and E respectively), 16 pin DIP flat  
pack (case outline F), and leadless ceramic chip carrier  
(case outline 2). Devices may be purchased with a variety  
ofleadbendandplatingoptions,seeSelectionGuideTable  
for details. Standard Microcircuit Drawing (SMD) parts are  
available for each package and lead style.  
Because the same functional die (emitters and detectors)  
are used for each channel of each device listed in this  
data sheet, absolute maximum ratings, recommended  
operatingconditions,electricalspecifications,andperfor-  
mance characteristics shown in the figures are identical  
for all parts. Occasional exceptions exist due to package  
variations and limitations and are as noted. Additionally,  
the same package assembly processes and materials are  
used in all devices. These similarities give justification for  
the use of data obtained from one part to represent other  
part’s performance for die related reliability and certain  
limited radiation test results.  
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