AOZ1284
Package Dimensions, SO-8 EP1
Gauge plane
0.2500
D0
C
L
L1
E1
E
E2
E3
L1'
D1
D
Note 5
7 (4x)
A2
A1
A
e
B
Dimensions in millimeters
Dimensions in inches
Symbols
Min.
1.40
0.00
1.40
0.31
0.17
4.80
3.20
3.10
5.80
—
Nom.
1.55
Max.
1.70
0.10
1.60
0.51
0.25
5.00
3.60
3.50
6.20
—
Symbols
Min.
Nom.
Max.
RECOMMENDED LAND PATTERN
A
A1
A2
B
A
A1
A2
B
0.055 0.061 0.067
0.000 0.002 0.004
0.055 0.059 0.063
0.012 0.016 0.020
0.05
3.70
1.50
0.406
—
C
C
0.007
—
0.010
D
4.96
D
0.189 0.195 0.197
0.126 0.134 0.142
0.122 0.130 0.138
0.228 0.236 0.244
2.20
D0
D1
E
3.40
D0
D1
E
3.30
5.74
6.00
2.71
e
1.27
e
—
0.050
—
E1
E2
E3
L
3.80
2.21
3.90
4.00
2.61
E1
E2
E3
L
0.150 0.153 0.157
0.087 0.095 0.103
0.016 REF
2.87
2.41
0.40 REF
0.95
0.40
—
1.27
0.10
8°
0.016 0.037 0.050
y
—
y
—
0°
—
—
3°
0.004
8°
0.80
UNIT: mm
1.27
0°
3°
0.635
| L1–L1' |
L1
—
0.04
0.12
| L1–L1' |
L1
0.002 0.005
0.041 REF
1.04 REF
Notes:
1. Package body sizes exclude mold flash and gate burrs.
2. Dimension L is measured in gauge plane.
3. Tolerance 0.10mm unless otherwise specified.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
5. Die pad exposure size is according to lead frame design.
6. Followed from JEDEC MS-012
www.aosmd.com
Page 12 of 14
Rev. 0.5 March 2012
AOS [ ALPHA & OMEGA SEMICONDUCTORS ]
