AS1123
Datasheet ꢀ Detailed Description
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. At the falling edge of LD, the detailed error report of the selected
test is latched into the shift register and can be clocked out with n*16 clock cycles (n is the number of AS1123s in a chain) via pin SDO. At the
same time new data can be written into the shift register, which is loaded on the next rising edge of pin LD. This pattern is shown at the output
drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. SDI must be 1 for the first device.
Bit0 of the 16bit data word represents the temperature flag of the chip.
Figure 14. Detailed Temperature Warning Report Timing Diagram
Global Flag Readout
Detailed Error Report Readout
OEN
tH(L)
tGSW(ERROR)
t(SU)ERROR
LD
tP4
CLK
Don’t
Care
DBit15
DBit14 DBit13 DBit12 DBitn DBit2
New Data Input
DBit1 DBit0
SDI
Don’t
Care
TFLAG
TBit0
Undefined
SDO
Temperature Error Report Output
tP4
tP1
For detailed timing information see Timing Diagrams on page 8.
Detailed Temperature Warning Report Example:
Consider a case where four AS1123s are cascaded in one chain. The detailed error report lists the temperatures for each device in the chain:
IC1:[70°] IC2:[85°] IC3:[170°] IC4:[60°]
In this case, IC3 is overheated and will generate a global error, and therefore 4*16 clock cycles are needed to write out the detailed temperature
warning report, and optionally read in new data. The detailed temperature warning report would look like this:
XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX0 XXXXXXXXXXXXXXX1
The 0 in the detailed temperature warning report indicates that IC3 is the device with the overꢀtemperature condition.
Note: In an actual report there are no spaces in the output.
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