SYMBOL
FUNCTION
SP
CP
VDD
VSS
IOUT
EOS
Start Pulse: Input to start the line scan.
Clock Pulse: Input to clock the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
VSS is tied to ground: Connection topside common
Video Signal Current Output from a source follower.
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
8080 µm
Read Line
PI3039 IMAGE SENSOR, 192 PIXELS, 42 µm PITCH
360 µm
333 µm
SP
CP
VDD
VSS
IOUT
EOS
X
Y
NOTE: ALL PAD OPENINGS ARE 140 X 80 µm
X
NOTES:
X
Y
PAD
FUNCTION
1. THE DRAWING IS NOT TO SCALE.
30
30
30
30
30
30
575
SP
START INPUT
2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN.
3. THE PAD LOCATION ARE GIVEN IN THE TABLE.
4. THERE ARE 2 EXAMPLES OF THE X & Y LOCATIONS
SHOWN ON THE FIRST 2 PADS.
2195
3295
4373
5495
7272
CP
CLOCK INPUT
+5 SUPPLY
VDD
VSS
IOUT
EOS
TIED TO GROUND
VIDEO SIGNAL OUT
SCAN OUTPUT
5. ALL DIMENSIONS ARE IN µm.
Figure 2. Bonding Pad Layout Diagram:
Figure 2 shows the bonding pad locations for PI3039 Sensor Chip. The locations are referenced to the
lower left corner of the die.
Electro-Optical Characteristics (25o C)
Table 2, below, lists the electro-optical characteristics of PI3039 sensor chip at 25o C.
Parameters
Number of Photo-elements
Pixel-to-pixel spacing
Chip scanning rate
Symbols
Tint (1)
Typical
192
42
Units
elements
µm
Notes
38.4
@ typical 5 MHz pixel rate.
See note 2.
See note 2
µsec
(2)
Clock frequency
fclk
5.0
MHz
pC
IOUT (Saturation charge
output for a given sample time)
At 5.0 MHz clock frequency.
Qsat (3)
170 to 200
With 570nm light source.
At saturation exposure of
5.7 Joules/cm2
PAGE 2 OF 10, PI3039, 12/2/02
AMI [ AMI SEMICONDUCTOR ]
