FS612509-01/-02
1:9 Zero-Delay Clock Buffer IC
6.0
Package Information
Table 8: 24-pin TSSOP Package Dimensions
DIMENSIONS
INCHES
MIN.
A
A
1
A
2
b
C
D
E
1
E
e
L
S
θ
1
θ
2
θ
3
-
0.002
0.0315
0.0075
0.0035
0.303
0.169
MAX.
0.047
0.006
0.0413
0.0118
0.0079
0.311
0.177
MILLIMETERS
MIN.
-
0.05
0.80
0.19
0.09
7.70
4.30
MAX.
1.20
0.15
1.05
0.30
0.20
7.90
4.50
1
24
E
1
E
AMERICAN MICROSYSTEMS, INC.
0.252
0.0256
0.0177
0.0079
0°
12 REF
12 REF
0.0295
-
8°
6.40 BSC
0.65 BSC
0.45
0.20
0°
12 REF
12 REF
0.75
-
8°
b
e
A
2
D
A
1
A
c
S
θ
2
L
SEATING PLANE
θ
3
θ
1
BASE PLANE
Table 9: 24-pin TSSOP Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
Θ
JA
L
11
L
12
L
13
C
11
C
12
C
13
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Longest lead
Longest lead to any 1
st
adjacent lead
Longest lead to any 2 adjacent lead
Longest lead to V
SS
Longest lead to any 1
st
adjacent lead
Longest lead to any 2 adjacent lead
nd
nd
TYP.
84
1.7
0.6
0.24
0.3
0.1
0.007
UNITS
°C/W
nH
nH
pF
pF
ISO9001
QS9000
8
AMI [ AMI SEMICONDUCTOR ]
