AMD
As s e m b ly/P a c k a g in g :
CerDIP (CD 028)
LCC (CLT028)
PLCC (PL 028)
Assembly Location:
Manila
Bangkok
Ld. Frame Material:
Bond Wire:
CD: Alloy 42
Copper
1.25 mil
1.25 mil Au
Al/Si (1% Si)
Bonding Method:
Die Attach:
Ultrasonic
Ag Glass
N/A
Ball Bonding
Ag Filled Epoxy
Sumitomo 6300H
Molding Compound:
Lead Finish
CD 028 Comm.:
Tin Plate
CD 028 Mil.:
CLT028 Mil.:
Solder Dip
Solder Dip
PL 028:
Solder Plate
Thermal Impedance:
CD 0281
CLT0282
PL 0282
θJA
θJC
TX :
RX:
41°C/W
43°C/W
n/a
n/a
53°C/W
52°C/W
TX, RX:
4°C/W
10°C/W
12°C/W
1 socketed
2 surface mounted
TAXIchip Integrated Circuits Technical Manual
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