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PPC405CR-3BC200CZ 参数 Datasheet PDF下载

PPC405CR-3BC200CZ图片预览
型号: PPC405CR-3BC200CZ
PDF下载: 下载PDF文件 查看货源
内容描述: 405CR的PowerPC嵌入式处理器 [PowerPC 405CR Embedded Processor]
分类和应用: PC
文件页数/大小: 42 页 / 820 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
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Revision 1.02 – January 11, 2005  
PPC405CR – PowerPC 405CR Embedded Processor  
Data Sheet  
Table 7. Absolute Maximum Ratings  
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause  
permanent damage to the device  
Characteristic  
Supply Voltage (Internal Logic)  
Symbol  
Value  
0 to +2.7  
Unit  
V
VDD  
OVDD  
AVDD  
VIN  
Supply Voltage (I/O Interface)  
0 to +3.6  
V
PLL Supply Voltage  
0 to +2.7  
V
-0.6 to VDD+0.6  
-0.6 to OVDD+0.6  
-0.6 to OVDD+2.4  
Input Voltage (2.5V CMOS receivers)  
Input Voltage (3.3V LVTTL receivers)  
Input Voltage (5.0V LVTTL receivers)  
Storage Temperature Range  
V
VIN  
V
VIN  
V
TSTG  
TC  
-55 to +150  
-40 to +120  
°C  
°C  
Case temperature under bias  
Note: All specified voltages are with respect to GND.  
Figure 3. Package Thermal Specifications  
The PPC405CR is designed to operate within a case temperature range of -40°C to +85°C. Thermal resistance values for the E-  
PBGA package in a convection environment are as follows:  
Airflow  
ft/min (m/sec)  
Symbol  
Thermal Resistance  
Unit  
0 (0)  
100 (0.51)  
200 (1.02)  
Junction-to-case  
θJC  
θCA  
2
2
2
°C/W  
°C/W  
Case-to-ambient 1  
18  
16  
15  
Notes:  
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.  
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:  
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.  
b. TA = TC – P×θCA, where TA is ambient temperature and P is power consumption.  
c. TCMax = TJMax – P×θJC, where TJMax is maximum junction temperature and P is power consumption.  
28  
AMCC  
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