Revision 1.02 – January 11, 2005
PPC405CR – PowerPC 405CR Embedded Processor
Data Sheet
Figure 2. 27mm, 316-Ball E-PBGA Package
Reserved Area for Ejector Pin Mark x 4 TYP
Top View
Corner Shape is Chamferred or Rounded
Gold Gate Release
Corresponds to
A1 Ball Location
15.0 TYP
27.0 REF
7.5 TYP
27.0
Notes: 1. All dimensions are in mm.
2. Package available in leaded and lead-free configurations.
C
C
0.20
0.25
0.35
0.20
A
C
27.0
Bottom View
24.13
C
Y
W
V
U
T
1.27 TYP
Mold
Compound
R
P
N
M
L
Thermal Balls
K
27.0
PCB
Substrate
J
H
G
F
E
D
C
B
A
B
9
11
15 17
19
18
20
1
3
5
7
13
2
4
14
6
8
10 12
16
0.6 ± 0.1
2.65 MAX
0.75 ± 0.15 SOLDERBALL x 316
M
∅ 0.30 C A B
M
∅ 0.15
C
10
AMCC
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
