MAX 7000A Programmable Logic Device Data Sheet
MAX 7000A devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPM7128AE device in a 100-pin
FineLine BGA package to an EPM7512AE device in a 256-pin
FineLine BGA package.
SameFrame
Pin-Outs
The Altera design software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 7).
Figure 7. SameFrame Pin-Out Example
Printed Circuit Board
Designed for 256-Pin FineLine BGA Package
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
100-Pin FineLine BGA Package
(Reduced I/O Count or
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
Logic Requirements)
Altera Corporation
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