16
Device and Package Cross Reference
Table 16.
APEX 20K Devices (Part 2 of 2)
Device
PQFP, Wire Bond
EP20K200
PQFP, Wire Bond
BGA, Wire Bond
FBGA, Wire Bond, Option 2
EP20K300
EP20K400
FBGA, Wire Bond, Option 2
BGA, Wire Bond, Option 3
PGA, Wire Bond
FBGA, Flip Chip, Option 1
Package
Pins
208
240
356
484
672
652
655
672
ACEX 1K Devices
lists the device name, package type, and number of pins for the ACE 1K
device family.
1
The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 17.
ACEX 1K Devices
Device
TQFP, Wire Bond
EP1K10
TQFP, Wire Bond
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
EP1K30
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
TQFP, Wire Bond
EP1K50
PQFP, Wire Bond
FBGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 2
PQFP, Wire Bond
EP1K100
FBGA, Wire Bond, Option 1
FBGA, Wire Bond, Option 2
Package
Pins
100
144
208
256
144
208
256
144
208
256
484
208
256
484
© December 2011
Altera Corporation
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