7–18
Chapter 7: Package Information
Document Revision History
Document Revision History
shows the revision history for this chapter.
Table 7–3.
Document Revision History
Date and Revision
October 2008,
version 2.1
December 2007,
version 2.0
Changes Made
■
Summary of Changes
—
■
Updated New Document Format.
Updated
and
Added
and
sections.
Replaced
with correct diagram.
■
■
Updated document with
MAX IIZ information.
Added information about
68-Pin Micro FineLine
Ball-Grid Array and 144-
Pin Micro FineLine
Ball-Grid Array.
—
—
—
—
■
■
December 2006,
version 1.4
July 2006,
version 1.3
August 2005,
version 1.2
December 2004,
version 1.1
■
Added document revision history.
Updated packaging information.
Updated the 100-pin plastic thin quad flat pack (TQFP)
information.
Updated Board Decoupling Guidelines section (changed
the 0.2 value to 0.1.)
■
■
■
ALTERA [ ALTERA CORPORATION ]
