Chapter 7: Package Information
Package Outlines
7–15
256-Pin FineLine Ball-Grid Array (FBGA)
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All dimensions and tolerances conform to ANSI Y14.5M – 1994
Controlling dimension is in millimeters
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
Package Outline Dimension Table
Specification
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034
Variation:
AAF-1
A
A1
A2
A3
D
E
Package Information
Description
Ordering Code Reference
Package Acronym
Substrate Material
Millimeters
Min.
—
0.30
—
Nom.
—
—
—
0.70 REF
17.00 BSC
17.00 BSC
Max.
2.20
—
1.80
Solder Ball Composition
JEDEC Outline Reference
Maximum Lead
Coplanarity
Weight
Moisture Sensitivity Level
0.008 inches (0.20 mm)
1.5 g
Printed on moisture barrier
bag
b
e
0.50
0.60
1.00 BSC
0.70
ALTERA [ ALTERA CORPORATION ]
