7–16
Chapter 7: Package Information
Package Outlines
Figure 7–8.
256-Pin FineLine BGA Package Outline
TOP
VIEW
D
BOTTOM
VIEW
Pin A1
Corner
Pin A1 ID
e
E
b
e
A2
A3
A
324-Pin FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994
Controlling dimension is in millimeters
Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface
A1
Package Information (Part 1 of 2)
Description
Ordering Code Reference
Package Acronym
Substrate Material
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034
Variation:
AAG-1
0.008 inches (0.20 mm)
1.6 g
Package Outline Dimension Table (Part 1 of 2)
Specification
Symbol
Min.
A
A1
A2
A3
D
E
—
0.30
—
Millimeters
Nom.
—
—
—
0.70 REF
19.00 BSC
19.00 BSC
Max.
2.20
—
1.80
Solder Ball Composition
JEDEC Outline Reference
Maximum Lead
Coplanarity
Weight
b
0.50
0.60
0.70
ALTERA [ ALTERA CORPORATION ]
