7–2
Chapter 7: Package Information
Thermal Resistance
Table 7–1. MAX II Devices in TQFP, FineLine BGA, and Micro FineLine BGA Packages (Part 2 of 2)
Device
Package
Pin
EPM570
FBGA (1)
100
EPM570G
EPM570
MBGA (1)
100
100
EPM570G
EPM570Z
EPM570
TQFP
EPM570G
EPM570Z
EPM570
MBGA (1)
144
144
TQFP
EPM570G
EPM570
FBGA
256
256
EPM570G
EPM570
MBGA (1)
EPM570G
EPM570Z
EPM1270
EPM1270G
TQFP
FBGA
144
256
256
256
324
MBGA (1)
FBGA
EPM2210
EPM2210G
FBGA
Note to Table 7–1:
(1) Packages available in lead-free versions only.
Thermal Resistance
Table 7–2 provides θJA (junction-to-ambient thermal resistance) and θJC (junction-to-
case thermal resistance) values for Altera MAX II devices.
Table 7–2. Thermal Resistance of MAX II Devices (Part 1 of 2)
θJA (°C/W)
θJA (°C/W)
θJA (°C/W)
θJA (°C/W)
Device
EPM240Z
EPM240
Pin Count
Package
MBGA
FBGA
θJC (°C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
68
35.5
68.7
63.0
45.2
60.9
43.2
59.2
41.5
100
20.8
51.2
EPM240G
EPM240
100
MBGA
32.1
53.8
47.7
45.7
44.0
EPM240G
EPM240Z
EPM240
100
100
TQFP
FBGA
12.0
14.8
39.5
42.8
37.5
36.8
35.5
34.9
31.6
33.3
EPM240G
EPM570
EPM570G
MAX II Device Handbook
© October 2008 Altera Corporation
ALTERA [ ALTERA CORPORATION ]
