FLEX 6000 Programmable Logic Device Family Data Sheet
Figure 14. IOE Connection to Column Interconnect
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
IOE
IOE
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
LAB
Any LE can drive a
pin through the row
and local interconnect.
Column Interconnect
Row Interconnect
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
SameFrame
Pin-Outs
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see Figure 15).
Altera Corporation
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