15. Package Information for
Cyclone II Devices
CII51015-2.3
This chapter provides package information for Altera® Cyclone® II
devices, including:
Introduction
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■
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Device and package cross reference
Thermal resistance values
Package outlines
Table 15–1 shows Cyclone II device package options.
Table 15–1. Cyclone II Device Package Options
Device
Package
Pins
EP2C5
Plastic Thin Quad Flat Pack (TQFP) – Wirebond
Plastic Quad Flat Pack (PQFP) – Wirebond
Low profile FineLine BGA® – Wirebond
TQFP – Wirebond
144
208
256
144
208
256
256
484
240
256
484
484
484
672
484
484
672
672
896
EP2C8
PQFP – Wirebond
Low profile FineLine BGA – Wirebond
Low profile FineLine BGA, Option 2 – Wirebond
FineLine BGA, Option 3– Wirebond
PQFP – Wirebond
EP2C15
EP2C20
Low profile FineLine BGA, Option 2 – Wirebond
FineLine BGA, Option 3– Wirebond
FineLine BGA, Option 3 – Wirebond
Ultra FineLine BGA – Wirebond
FineLine BGA, Option 3 – Wirebond
FineLine BGA, Option 3 – Wirebond
Ultra FineLine BGA – Wirebond
FineLine BGA, Option 3 – Wirebond
FineLine BGA, Option 3 – Wirebond
FineLine BGA – Wirebond
EP2C35
EP2C50
EP2C70
Altera Corporation
February 2007
15–1
ALTERA [ ALTERA CORPORATION ]
