Package Information for Cyclone II Devices
Table 15–2. Thermal Resistance of Cyclone II Devices for Board Meeting JEDEC Specifications (Part 2 of 2)
θJA (°C/W)
Still Air
θ
JA (°C/W)
θ
JA (° C/W)
θ
JA (° C/W)
θJC
Pin
Count
Device
Package
100 ft./min. 200 ft./min. 400 ft./min. (°C/W)
EP2C50
484 FineLine BGA
484 Ultra FineLine BGA
672 FineLine BGA
672 FineLine BGA
896 FineLine BGA
18.4
19.6
17.7
16.9
16.3
14.4
15.6
13.7
13
12.4
13.6
11.8
11.1
10.5
10.9
11.9
10.2
9.7
2.8
4.4
2.6
2.2
2.1
EP2C70
11.9
9.1
Table 15–3 provides board dimension information for each package.
Table 15–3. PCB Dimensions Notes (1), (2)
Package
Dimension
(mm)
Board
Dimension
(mm)
2.5 mm
Thick
Signal
Layers
Power/Ground
Layers
F896
10
8
10
8
31
27
27
23
23
19
19
17
91
87
87
83
83
79
79
77
F672
F672
F484
F484
U484
U484
F256
7
7
7
7
6
6
7
7
6
6
6
6
Notes to Table 15–3:
(1) Power layer Cu thickness 35 um, Cu 90%
(2) Signal layer Cu thickness 17 um, Cu 15%
Altera Corporation
February 2007
15–3
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
