Package Outlines
Table 15–4 provides θJA (junction-to-ambient thermal resistance) values,
θJC (junction-to-case thermal resistance) values, θJB (junction-to-board
thermal resistance) values for Cyclone II devices on a typical board.
Table 15–4. Thermal Resistance of Cyclone II Devices for Typical Board
θJA
(°C/W)
Still Air
θJA (°C/W) θJA (°C/W) θJA (°C/W)
100 ft./min. 200 ft./min. 400 ft./min. (° C/W) (°C/W)
θJC
θJB
Pin
Count
Device
Package
EP2C5 256
EP2C8 256
EP2C15 256
484
FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
Ultra FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
Ultra FineLine BGA
Ultra FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
FineLine BGA
30.2
27.9
24.7
20.5
24.7
20.5
18.8
20
25.8
23.2
20.1
16.2
20.1
16.2
14.5
15.5
13.3
13.5
13.8
14.6
15
22.9
20.5
17.5
13.9
17.5
13.9
12.3
13.2
11.3
11.4
11.7
12.3
12.7
10.5
9.8
20.6
18.4
15.3
12.2
15.3
12.2
10.6
11.3
9.8
8.7
7.1
5.5
4.2
5.5
4.2
3.3
5
14.8
12.3
9.1
7.2
9.1
7.2
5.7
5.3
5.5
4.5
4.6
4.4
4.6
4.6
3.8
3.9
3.7
EP2C20 256
484
EP2C35 484
484
672
17.4
17.7
18.1
19
3.1
2.8
2.8
4.4
4.4
2.6
2.2
2.2
2.1
EP2C50 484
484
9.8
10.1
10.6
10.9
9
484
484
19.4
16.5
15.7
15.9
14.6
672
12.4
11.7
11.9
10.7
EP2C70 672
672
8.3
9.9
8.4
896
8.9
7.6
The package outlines on the following pages are listed in order of
ascending pin count.
Package
Outlines
144-Pin Plastic Thin Quad Flat Pack (TQFP) – Wirebond
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Pin 1 may be indicated by an ID dot, or a special feature, in its
proximity on package surface.
15–4
Altera Corporation
February 2007
Cyclone II Device Handbook, Volume 1
ALTERA [ ALTERA CORPORATION ]
