Chapter 1: Enhanced Configuration Devices (EPC4, EPC8, and EPC16) Data Sheet
1–31
Package
Table 1–17. Enhanced Configuration Device DC Operating Conditions
Symbol
VCC
Parameter
Supplies voltage to core
High-level input voltage
Condition
Min
3.0
2.0
Typ
3.3
—
Max
Unit
—
—
3.6
V
V
VIH
VCC
+
0.3
VIL
Low-level input voltage
—
—
—
—
0.8
—
V
V
VOH
3.3-V mode high-level TTL output
voltage
IOH = –4 mA
2.4
3.3-V mode high-level CMOS
output voltage
IOH = –0.1 mA
VCC
0.2
–
—
—
V
VOL
Low-level output voltage TTL
Low-level output voltage CMOS
Input leakage current
IOL = –4 mA DC
OL = –0.1 mA DC
—
—
—
—
—
—
0.45
0.2
10
V
V
I
II
VI = VCC or ground
VO = VCC or ground
–10
–10
A
A
IOZ
Tri-state output off-state current
10
Table 1–18. Enhanced Configuration Device ICC Supply Current Values
Symbol
Parameter
Current (standby)
Condition
Min
—
Typ
50
Max
Unit
A
ICC0
ICC1
—
—
150
90
VCC supply current (during
configuration)
—
60
mA
ICCW
VCCW supply current
—
—
(1)
(1)
—
Note to Table 1–18:
(1) For VCCW supply current information, refer to the appropriate flash memory data sheet at www.altera.com.
Table 1–19. Enhanced Configuration Device Capacitance
Symbol
Parameter
Input pin capacitance
Output pin capacitance
Condition
Min
—
Max
Unit
CIN
—
—
10
10
pF
pF
COUT
—
Package
The EPC16 enhanced configuration device is available in both the 88-pin UFBGA
package and the 100-pin PQFP package. The UFBGA package, which is based on
0.8-mm ball pitch, maximizes board space efficiency. A board can be laid out for this
package using a single PCB layer. The EPC8 and EPC4 devices are available in the
100-pin PQFP package.
Enhanced configuration devices support vertical migration in the 100-pin PQFP
package.
© December 2009 Altera Corporation
Configuration Handbook (Complete Two-Volume Set)
ALTERA [ ALTERA CORPORATION ]
