Chapter 1: Overview for Cyclone V Device Family
1–3
Cyclone V Features Summary
Table 1–1. Summary of Features for Cyclone V Devices (Part 2 of 2)
Feature
Details
■ Dual-core ARM Cortex-A9 MPCore processor—up to 800 MHz maximum frequency with support
for symmetric and asymmetric multiprocessing
■ Interface peripherals—10/100/1000 Ethernet media access control (MAC), USB 2.0 On-The-GO
(OTG) controller, serial peripheral interface (SPI), Quad SPI flash controller, NAND flash controller,
SD/MMC/SDIO controller, UART, controller area network (CAN), I2C interface, and up to 71 HPS I/O
interfaces
HPS
■ System peripherals—general-purpose and watchdog timers, direct memory access (DMA)
(Cyclone V SE, SX,
and ST devices
only)
controller, FPGA configuration manager, and clock and reset managers
■ On-chip RAM and boot ROM
■ HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA
bridges that allow the FPGA fabric to master transactions to slaves in the HPS, and vice versa.
■ FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport
front end (MPFE) of the HPS SDRAM controller
■ ARM CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
High-performance
FPGA fabric
Enhanced 8-input ALM with four registers
■ M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
Internal memory
blocks
■ Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of
the ALMs as MLAB memory
■ Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
■ Integer mode and fractional mode
Phase-locked
loops (PLLs)
■ 550 MHz global clock network
Clock networks
■ Global, quadrant, and peripheral clock networks
■ Clock networks that are not used can be powered down to reduce dynamic power
■ Partial and dynamic reconfiguration of the FPGA
■ CvP
■ Active serial (AS) x1 and x4, fast passive parallel (FPP) x8 and x16, passive serial (PS), and JTAG
Configuration
options
■ Enhanced advanced encryption standard (AES) design security features
■ Tamper protection
■ Wirebond low-halogen packages
■ Multiple device densities with compatible package footprints for seamless migration between
Packaging
different device densities
■ RoHS-compliant options
February 2012 Altera Corporation
Cyclone V Device Handbook
Volume 1: Device Overview and Datasheet