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AS4C128M16D3L-12BCN 参数 Datasheet PDF下载

AS4C128M16D3L-12BCN图片预览
型号: AS4C128M16D3L-12BCN
PDF下载: 下载PDF文件 查看货源
内容描述: [Fully synchronous operation]
分类和应用:
文件页数/大小: 84 页 / 2090 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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2Gb DDR3L AS4C128M16D3L  
- Burst Length, Type, and Order  
Accesses within a given burst may be programmed to sequential or interleaved order. The burst type is  
selected via bit A3 as shown in the MR0 Definition as above figure. The ordering of access within a burst is  
determined by the burst length, burst type, and the starting column address. The burst length is defined by bits  
A0-A1. Burst lengths options include fix BC4, fixed BL8, and on the fly which allow BC4 or BL8 to be selected  
coincident with the registration of a Read or Write command via A12/BC#  
Table 6. Burst Type and Burst Order  
Starting Column  
Read  
Write  
Sequential  
A3=0  
Interleave  
A3=1  
Address  
Burst Length  
Note  
A2  
0
0
0
0
1
1
1
1
0
1
0
0
0
0
1
1
1
1
V
A1  
0
0
1
1
0
0
1
1
V
V
0
0
1
1
0
0
1
1
V
A0  
0
1
0
1
0
1
0
1
V
V
0
1
0
1
0
1
0
1
V
0, 1, 2, 3, T, T, T, T 0, 1, 2, 3, T, T, T, T  
1, 2, 3, 0, T, T, T, T 1, 0, 3, 2, T, T, T, T  
2, 3, 0, 1, T, T, T, T 2, 3, 0, 1, T, T, T, T  
3, 0, 1, 2, T, T, T, T 3, 2, 1, 0, T, T, T, T  
4, 5, 6, 7, T, T, T, T 4, 5, 6, 7, T, T, T, T  
5, 6, 7, 4, T, T, T, T 5, 4, 7, 6, T, T, T, T  
6, 7, 4, 5, T, T, T, T 6, 7, 4, 5, T, T, T, T  
7, 4, 5, 6, T, T, T, T 7, 6, 5, 4, T, T, T, T  
0, 1, 2, 3, X, X, X, X 0, 1, 2, 3, X, X, X, X  
4, 5, 6, 7, X, X, X, X 4, 5, 6, 7, X, X, X, X  
Read  
Write  
1, 2, 3  
4
Chop  
1, 2, 4, 5  
0, 1, 2, 3, 4, 5, 6, 7  
0, 1, 2, 3, 4, 5, 6, 7  
1, 2, 3, 0, 5, 6, 7, 4 1, 0, 3, 2, 5, 4, 7, 6  
2, 3, 0, 1, 6, 7, 4, 5 2, 3, 0, 1, 6, 7, 4, 5  
3, 0, 1, 2, 7, 4, 5, 6 3, 2, 1, 0, 7, 6, 5, 4  
4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3  
5, 6, 7, 4, 1, 2, 3, 0 5, 4, 7, 6, 1, 0, 3, 2  
6, 7, 4, 5, 2, 3, 0, 1 6, 7, 4, 5, 2, 3, 0, 1  
7, 4, 5, 6, 3, 0, 1, 2 7, 6, 5, 4, 3, 2, 1, 0  
0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7  
Read  
Write  
2
8
2, 4  
Note 1: In case of burst length being fixed to 4 by MR0 setting, the internal write operation starts two clock cycles earlier  
than for the BL8 mode. This means that the starting point for tWR and tWTR will be pulled in by two clocks. In case  
of burst length being selected on-the-fly via A12/BC#, the internal write operation starts at the same point in time like  
a burst of 8 write operation. This means that during on-the-fly control, the starting point for tWR and tWTR will not be  
pulled in by two clocks.  
Note 2: 0~7 bit number is value of CA[2:0] that causes this bit to be the first read during a burst.  
Note 3: T: Output driver for data and strobes are in high impedance.  
Note 4: V: a valid logic level (0 or 1), but respective buffer input ignores level on input pins.  
Note 5: X: Don’t Care.  
- CAS Latency  
The CAS Latency is defined by MR0 (bit A2, A4~A6) as shown in the MR0 Definition figure. CAS Latency is the  
delay, in clock cycles, between the internal Read command and the availability of the first bit of output data.  
DDR3L SDRAM does not support any half clock latencies. The overall Read Latency (RL) is defined as  
Additive Latency (AL) + CAS Latency (CL); RL = AL + CL.  
- Test Mode  
The normal operating mode is selected by MR0 (bit7=0) and all other bits set to the desired values shown in  
the MR0 definition figure. Programming bit A7 to a ‘1’ places the DDR3L SDRAM into a test mode that is only  
used by the DRAM manufacturer and should not be used. No operations or functionality is guaranteed if A7=1.  
- DLL Reset  
The DLL Reset bit is self-clearing, meaning it returns back to the value of ‘0’ after the DLL reset function has  
been issued. Once the DLL is enabled, a subsequent DLL Reset should be applied. Anytime the DLL reset  
function is used, tDLLK must be met before any functions that require the DLL can be used (i.e. Read  
commands or ODT synchronous operations.)  
Confidential  
15  
Rev. 2.0  
Aug. /2014  
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