9
HDMP-1637A (Transmitter Section)
Output Jitter Characteristics
(measured with equivalent parts which have TTL REFCLK input)
T
A
= 0°C to +70°C, V
CC
= 3.15 V to 3.45 V
Symbol
Parameter
RJ
[1]
Random Jitter at DOUT, the High Speed Electrical Data Port, specified as
1 sigma deviation of the 50% crossing point (RMS)
DJ
[1]
Deterministic Jitter at DOUT, the High Speed Electrical Data Port (pk-pk)
Units
ps
ps
Typ.
8
25
Note:
1. Defined by Fibre Channel Specification X3.230-1994 FC-PH Standard, Annex A, Section A.4 and tested using measurement
method shown in Figure 8.
70311A
CLOCK SOURCE
70841B
PATTERN
GENERATOR
+K28.5, -K28.5
70841B
PATTERN
GENERATOR*
0000011111
+ DATA
- DATA
1.25 GHz
70311A
CLOCK SOURCE
125 MHz
83480A
OSCILLOSCOPE
TRIGGER
CH1
CH2
DIVIDE
BY 10
CIRCUIT
(DUAL
OUTPUT)
1.25 GHz
+ DATA
- DATA
83480A
OSCILLOSCOPE
DIVIDE
BY 2
TRIGGER
CH1
CH2
+DOUT
-DOUT
+DOUT
-DOUTi
VARIABLE
DELAY
-DIN
+DIN
HDMP-1637A
PECL
* PATTERN
GENERATOR
PROVIDES A
DIVIDE BY
10 FUNCTION.
REFCLK LOOPEN
Txi[0..9]
HDMP-1637A
125 MHz
REFCLK
Txi[0..9]
ENBYTSYNC
LOOPEN
Rx[0..9]
PECL
0011111000
(STATIC K28.7)
B. BLOCK DIAGRAM OF DJ MEASUREMENT METHOD
A. BLOCK DIAGRAM OF RJ MEASUREMENT METHOD
Figure 8. Transmitter Jitter Measurement Method.
HDMP-1637A (TRx)
Thermal and Power Temperature Characteristics
T
A
= 0°C to +70°C, V
CC
= 3.15 V to 3.45 V
Symbol
Parameter
P
D,TRx[1,2]
Transceiver Power Dissipation, Outputs connected per
recommended bias terminations with idle pattern
Θ
jc [3]
Thermal Resistance, Junction to Case
Units
mW
°C/W
Typ.
620
11
Max.
900
Notes:
1. P
D
is obtained by multiplying V
CC
by I
CC
and subtracting the power dissipated outside the chip at the high speed bias resistors.
2. Specified with high speed outputs biased with 150
Ω
resistors and receiver TTL outputs driving 10 pF loads.
3. Based on independent package testing by Agilent Technologies.
Θ
ja
for these devices is 56.1°C/W for the HDMP-1637A.
Θ
ja
is
measured on a standard 3x3" FR4 PCB in a still air environment. To determine the actual junction temperature in a given
application, use the following: T
j
= T
C
+ (Θ
jc
x P
D
), where T
C
is the case temperature measured on the top center of the package
and P
D
is the power being dissipated.