11
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
2
3
4
5
6
7
8
9
48
47
46
45
44
43
42
41
40
*GND
TX[0]
TX[1]
TX[2]
RXCAP0
BYTSYNC
GND_RXTTL
RX[0]
*V
CC
RX[1]
TX[3]
TX[4]
TX[5]
TX[6]
RX[2]
V
_RXTTL
CC
HDMP-1637A
xxxx-x Rz.zz
RX[3]
RX[4]
RX[5]
RX[6]
*V
10
11
12
13
14
15
16
39
38
37
36
35
34
33
CC
TX[7]
TX[8]
S
YYWW
V
_RXTTL
CC
TX[9]
RX[7]
*GND
RX[8]
GND_TXA
TXCAP1
RX[9]
GND_RXTTL
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
xxxx-x = WAFER LOT NUMBER–BUILD NUMBER
Rz.zz = DIE REVISION
S = SUPPLIER CODE
YYWW = DATE CODE (YY = YEAR, WW = WORK WEEK)
COUNTRY = COUNTRY OF MANUFACTURE
(MARKED ON BACK OF DEVICE)
*N/C: THIS PIN IS CONNECTED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
IT CAN BE LEFT OPEN, HOWEVER, TTL LEVELS CAN ALSO BE APPLIED TO THIS PIN.
*V : THIS PIN IS BONDED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
CC
HOWEVER, IT IS RECOMMENDED THAT THIS PIN BE CONNECTED TO V
IN ORDER
CC
TO CONFORM WITH THE X3T11 "10-BIT SPECIFICATION," AND TO HELP DISSIPATE HEAT.
*GND: THIS PIN IS BONDED TO AN ISOLATED PAD AND HAS NO FUNCTIONALITY.
HOWEVER, IT IS RECOMMENDED THAT THIS PIN BE CONNECTED TO GND IN ORDER TO
CONFORM WITH THE X3T11 "10-BIT SPECIFICATION," AND TO HELP DISSIPATE HEAT.
HDMP-1637 fig 11
Figure 11. HDMP-1637A (TRx) Package Layout and Marking, Top View.
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
