HCPL-814-300E
7.62 ± 0.3
(0.3)
4.6 ± 0.5
(0.181)
DATE CODE *1
3.5 ± 0.5
(0.138)
0.26
(0.010)
A 814
LEAD FREE
ANODE
6.5 ± 0.5
(0.256)
Y WW
1.0 ± 0.25
(0.039)
1.2 ± 0.1
(0.047)
0.35 ± 0.25
(0.014)
10.16 ± 0.3
(0.4)
2.54 ± 0.25
(0.1)
RANK *2
DIMENSIONS IN MILLIMETERS AND (INCHES)
30 seconds
Solder Reflow Temperature Profile
260°C (Peak Temperature)
1) One-time soldering reflow is
recommended within the
250°C
217°C
200°C
condition of temperature and
time profile shown at right.
150°C
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
device. Keep the temperature on
the package of the device within
the condition of (1) above.
Absolute Maximum Ratings
Parameters
Symbol
Min.
–55
Max.
125
Units
˚C
Storage Temperature
Ambient Operating Temperature
T
T
T
S
–30
100
˚C
A
Lead Solder Temperature for 10s
(1.6 mm below seating plane)
260
˚C
sol
Average Forward Current
Input Power Dissipation
Collector Current
I
±50
70
mA
mW
mA
V
F
P
I
I
50
C
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage
V
V
P
P
V
35
CEO
ECO
C
6
V
150
200
mW
mW
tot
5000
V
rms
iso
[1]
(AC for 1 minute, R.H. = 40 ~ 60%)
3
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
