Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
PEAK
TEMP.
230˚C
2.5˚C ± 0.5˚C/SEC.
160˚C
150˚C
140˚C
3˚C + 1˚C/–0.5˚C
100
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
50
0
ROOM TEMPERATURE
0
100
TIME (SECONDS)
150
200
250
30
SEC.
30
SEC.
SOLDERING
TIME
200˚C
200
TEMPERATURE (˚C)
Recommended Pb-Free IR Profile
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
tp
Tp
217 ˚C
TL
Tsmax
Tsmin
260 +0/-5 ˚C
TEMPERATURE (˚C)
RAMP-UP
3 ˚C/SEC. MAX.
150 - 200 ˚C
RAMP-DOWN
6 ˚C/SEC. MAX.
ts
PREHEAT
60 to 180 SEC.
25
t 25 ˚C to PEAK
tL
60 to 150 SEC.
TIME (SECONDS)
NOTES:
THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 ˚C, Tsmin = 150 ˚C
4
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