Package Dimensions
20.01
(0.790)
MAX.
COLOR BIN
1.78
(0.070)
SEE
NOTE 3
2.84
REF.
1.27
(0.050)
(0.112)
PART NUMBER
12 11 10
9
4
4
8
5
7
3
6
DATE CODE
SEE NOTE 3
5.00 0.13
4.87
(0.192)
8.43
(0.332)
REF.
HCMS-23XX
1
2
2.41
(0.095)
2.79 0.13
(0.110 0.006)
1
2
3
PIN 1 MARKED BY DOT
ON BACK OF PACKAGE
C
L
3.56
(0.140)
PIN 1
LUMINOUS INTENSITY
CATEGORY
(0.197 0.005)
1.27 0.13
(0.050 0.005)
PIN
FUNCTION
PIN FUNCTION
1
2
3
4
5
6
COLUMN 1
COLUMN 2
COLUMN 3
COLUMN 4
COLUMN 5
7
8
9
DATA OUT
VB
5.08
(0.200)
V
DD
6.85
10 CLOCK
11 GROUND
(0.270)
2.54
(0.100)
INT. CONNECT* 12 DATA IN
0.25 0.08
TYP.
1.27
TYP.
* DO NOT CONNECT OR USE
(0.010 0.003)
(0.050)
2.54 0.13
(0.100 0.005)
NON ACCUM.
6.35 0.25
(0.250 0.010)
NOTES:
TYP.
0.54 0.08
(0.020 0.003)
1. DIMENSIONS IN MILLIMETERS (INCHES).
2. UNLESS OTHERWISE SPECIFIED, THE
TOLERANCE ON ALL DIMENSIONS IS
0.38 mm ( 0.015).
3. CHARACTERS ARE CENTERED WITH RESPECT
TO LEADS WITHIN 0.13 mm ( 0.005).
4. LEAD MATERIAL IS COPPER ALLOY,
SOLDER DIPPED.
Absolute Maximum Ratings
Parameter
Value
Supply Voltage VDD to Ground
Data Input, Data Output, VB
Column Input Voltage, VCOL
–0.3 V to 7.0 V[1]
–0.3 V to VDD
–0.3 V to VDD
–55°C to +100°C
–55°C to +100°C
1.31 Watts
Free Air Operating Temperature Range, TA
Storage Temperature Range, Ts
Maximum Allowable Package Power Dissipation, PD[2,3] at TA = 71°C
Through-the-Wave Solder Temperature
1.59 mm (0.0±3") Below Body
250°C for 3 secs. max.
ESD Protection @ 1.5 kΩ, 100 pF
VZ = 4 kV
Notes:
1. Maximum duration 2 seconds.
2. Maximum allowable power dissipation is derived from VDD = 5.25 V, VB = 2.4 V, VCOL = 3.5 V, 20 LEDs ON per character, 20% DF.
3. HCMS-2353 derate above 71°C at 23 mW/°C, RqJ-A = 45°C/W.
Derating based on RqPC-A = 35°C/W per display for printed circuit board assembly.
2