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OR3T80-6PS240 参数 Datasheet PDF下载

OR3T80-6PS240图片预览
型号: OR3T80-6PS240
PDF下载: 下载PDF文件 查看货源
内容描述: 3C和3T现场可编程门阵列 [3C and 3T Field-Programmable Gate Arrays]
分类和应用: 现场可编程门阵列可编程逻辑
文件页数/大小: 210 页 / 4391 K
品牌: AGERE [ AGERE SYSTEMS ]
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Data Sheet  
June 1999  
ORCA Series 3C and 3T FPGAs  
ψ
JC  
Package Thermal Characteristics  
This JEDEC designated parameter correlates the junc-  
tion temperature to the case temperature. It is generally  
used to infer the junction temperature while the device  
is operating in the system. It is not considered a true  
thermal resistance, and it is defined by:  
There are four thermal parameters that are in common  
use: ΘJA, ψJC, ΘJC, and ΘJB. It should be noted that all  
the parameters are affected, to varying degrees, by  
package design (including paddle size) and choice of  
materials, the amount of copper in the test board or  
system board, and system airflow.  
TJ TC  
ψ
JC = -------------------  
Q
The data base containing the thermal values for all of  
Lucent Technologies’ IC packages is currently being  
updated to conform to modern JEDEC standards.  
Thus, Table 76 contains the currently available thermal  
specifications for Lucent Technologies’ FPGA pack-  
ages mounted on both JEDEC and non-JEDEC test  
boards. The thermal values for the newer package  
types correspond to those packages mounted on a  
JEDEC four-layer board. The values for the older pack-  
ages, however, correspond to those packages mounted  
on a non-JEDEC, single-layer, sparse copper board  
(see Note 2). It should also be noted that the values for  
the older packages are considered conservative.  
where TC is the case temperature at top dead center,  
TJ is the junction temperature, and Q is the chip power.  
During the ΘJA measurements described above,  
besides the other parameters measured, an additional  
temperature reading, TC, is made with a thermocouple  
ψJC is also  
attached at top-dead-center of the case.  
expressed in units of °C/watt.  
ΘJC  
This is the thermal resistance from junction to case. It  
is most often used when attaching a heat sink to the  
top of the package. It is defined by:  
ΘJA  
This is the thermal resistance from junction to ambient  
(a.k.a. theta-JA, R-theta, etc.).  
TJ TC  
ΘJC = --------------------  
Q
TJ TA  
ΘJA = -------------------  
Q
The parameters in this equation have been defined  
above. However, the measurements are performed with  
the case of the part pressed against a water-cooled  
heat sink so as to draw most of the heat generated by  
the chip out the top of the package. It is this difference  
in the measurement process that differentiates ΘJC  
where TJ is the junction temperature, TA is the ambient  
air temperature, and Q is the chip power.  
Experimentally, ΘJA is determined when a special ther-  
mal test die is assembled into the package of interest,  
and the part is mounted on the thermal test board. The  
diodes on the test chip are separately calibrated in an  
oven. The package/board is placed either in a JEDEC  
natural convection box or in the wind tunnel, the latter  
for forced convection measurements. A controlled  
amount of power (Q) is dissipated in the test chip’s  
heater resistor, the chip’s temperature (TJ) is deter-  
mined by the forward drop on the diodes, and the ambi-  
ent temperature (TA) is noted. Note that ΘJA is  
expressed in units of °C/watt.  
ψJC. ΘJC is a true thermal resistance and is  
from  
expressed in units of °C/watt.  
ΘJB  
This is the thermal resistance from junction to board  
(a.k.a. ΘJL). It is defined by:  
TJ TB  
ΘJB = ------------------  
Q
where TB is the temperature of the board adjacent to a  
lead measured with a thermocouple. The other param-  
eters on the right-hand side have been defined above.  
This is considered a true thermal resistance, and the  
measurement is made with a water-cooled heat sink  
pressed against the board so as to draw most of the  
heat out of the leads. Note that ΘJB is expressed in  
units of °C/watt, and that this parameter and the way it  
is measured is still in JEDEC committee.  
194  
Lucent Technologies Inc.  
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